| 刘晓英,马海涛,王来.超细氧化物颗粒对Sn\|58Bi钎料组织及性能影响[J].,2008,(1):51-57 |
| 超细氧化物颗粒对Sn\|58Bi钎料组织及性能影响 |
| Effect of super-fine oxide powders on mechanical properties and microstructures of Sn-58Bi |
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| DOI：10.7511/dllgxb200801010 |
| 中文关键词: Sn-58Bi复合无铅钎料 氧化物颗粒 钎焊接头组织 金属间化合物 |
| 英文关键词: Sn-58Bi lead-free solder oxide powders lead solder joint microstructure intermetallic compound |
| 基金项目:辽宁省自然科学基金资助项目(20041078);大连理工大学青年教师基金资助项目. |
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| 中文摘要: |
| 研究了分别添加1% Al 2O 3、Fe 2O 3、SiO 2、TiO 2超细粉末对Sn-58Bi共晶钎料的润湿性、钎焊接头微观组织及力学性能影响. 结果表明，氧化物粉末的添加对钎料熔点影响不大，但钎料润湿性及钎焊接头剪切强度明显提高；明显细化钎焊接头基体组织及界面金属间化合物颗粒大小，并且界面金属间化合物层厚度也有一定减薄；另外，可抑制钎焊时焊点表面Bi的氧化，因此焊点表面光亮度也有明显提高. |
| 英文摘要: |
| The effects of the addition of 1% oxide powders (Al 2O 3,Fe 2O 3,SiO 2,TiO 2) on wetting properties, microstructure and mechanical properties of the eutectic Sn-58Bi eutectic solder were investigated. It was shown that the melting point of the composite solders remained unchanged, while the wetting properties and the shear strength of the composite solder/Cu joints increased with the addition of oxide powders. The microstructure of the solder joints and the interfacial intermetallic compound were obviously refined, and the thickness of intermetallic compound was decreased with the addition of oxide powders. In addition, the oxide additions reduced the oxidation of Bi on the joint surface, and thus the brightness of the solder joint surface was improved. |
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