| 杜立群,王煜,王启佳,陈莉.聚合物SU-8光刻胶超声时效实验研究[J].,2010,(6):907-911 |
| 聚合物SU-8光刻胶超声时效实验研究 |
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| DOI：10.7511/dllgxb201006012 |
| 中文关键词: 超声时效 SU-8光刻胶 内应力测量 |
| 英文关键词: ultrasonic stress relief SU-8 photoresist internal stress measurement |
| 基金项目:国家自然科学基金资助项目(50675025). |
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| 中文摘要: |
| 利用超声时效技术减小聚合物SU-8光刻胶的内应力，讨论了其机理．以基片曲率法为基础，建立了轮廓法测量SU-8胶层内应力的计算模型．实验研究了超声时效技术在减小聚合物SU-8胶层内应力方面的作用．对比分析了超声时效实验前、后SU-8胶层的内应力值．实验结果显示，在超声时效10 min时，聚合物SU-8胶内应力减小2 MPa，消除率约为 23.17%． 这表明，在合适的实验参数下利用超声时效技术可以有效减小聚合物SU-8胶内应力． |
| 英文摘要: |
| To relieve the internal stress in SU-8 photoresist by using ultrasonic stress relief technology, the theory of the stress relief is discussed. Based on the wafer curvature measurement, a profile method was used to calculate the internal stress in SU-8 layers. The effect of ultrasonic stress relief to SU-8 layers was studied by experiments. The experimental values of internal stress before and after the ultrasonic stress relief process were compared. The experimental results show that the internal stress in SU-8 layers can be reduced for 2 MPa, and the relief rate is about 23.17% after 10 min of ultrasonic stress relief. It is proved that the internal stress in SU-8 layers can be effectively reduced when the proper parameters of ultrasonic stress relief are chosen. |
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