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| 铝铜微叠层复合材料的制备和组织性能研究 |
| Preparation, microstructure and properties of Al-Cu micro -laminated composite |
| 投稿时间：2020-05-06 修订日期：2020-05-21 |
| DOI： |
| 中文关键词: 微叠层复合材料 真空热压 显微组织 显微硬度 导电性能 导热性能 |
| 英文关键词: Al-Cu micro-laminated composite vacuum hot pressing microstructure microhardness conductivity thermal conductivity |
| 基金项目:国家自然科学(51971049)和国家重点研发计划变革性技术关键科学问题项目(2018YFA0702903) |
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| 中文摘要: |
| 本文通过真空热压法制备出铝铜金属间化合物微叠层复合材料,研究了保温时间、热压温度等工艺参数对成形过程的影响。采用SEM对叠层材料结合界面进行显微形貌观察,利用EPMA表征界面处元素分布,确定出扩散层的数量和种类；通过显微硬度测试分析结合界面处的硬度分布。另外,分析了不同工艺条件下铝铜叠层材料的导电率和导热系数。结果表明：随热压温度升高,铝铜微叠层复合材料结合界面处扩散层析出相种类逐渐变多、厚度逐渐增加,同时导致叠层材料导电率呈现出先升后降,而导热系数则保持单调下降的势态。显微硬度的测试结果呈现由Cu层和Al层向扩散层急剧增大的规律,且在扩散层中部硬度达到最大值。最终确定热压温度为570℃,保温时间为4h为较优的制备工艺,获得的铝铜微叠层材料导电率为55.75%IACS,导热系数为258.3W/(m.K)。 |
| 英文摘要: |
| In this paper, Al-Cu intermetallic compound micro-laminated composite was prepared by vacuum hot pressing method. The effects of holding time, hot pressing temperature and other process parameters on the forming process were studied. SEM was used to observe the micro morphology of the interface, EPMA was used to characterize the distribution of elements at the interface, and the number and type of diffusion layer were determined. In addition, the conductivity and thermal conductivity of Al-Cu laminated composite under different processing conditions are analyzed. The results show that with the increase of hot pressing temperature, the types and thickness of diffusion layers at the interface of Al-Cu micro-laminated composite gradually increase, and the conductivity of the composite increases first and then decreases, while the conductivity of the composite keeps a monotonous decline. The results show that the microhardness increases sharply from Cu layer and Al layer to diffusion layer, and the hardness reaches the maximum in the middle of diffusion layer. Finally, the optimal preparation process was determined as the hot pressing temperature of 570 ℃ and the holding time of 4h. The conductivity of the Al-Cu micro-laminated material was 55.75%IACS and the thermal conductivity was 258.3W/(m.K). |
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