文章摘要
赵宁,王建辉,潘学民,马海涛,王来.Cu含量对Sn基无铅钎料组织、界面反应影响[J].,2008,(5):661-667
Cu含量对Sn基无铅钎料组织、界面反应影响
Effect of Cu content on microstructure and interfacial reactions of Sn-based lead-free solders
  
DOI:10.7511/dllgxb200805008
中文关键词: 无铅钎料  Sn-Cu  Sn-Zn-Cu  界面反应  生长行为
英文关键词: lead-free solder  Sn-Cu  Sn-Zn-Cu  interfacial reaction  growth behavior
基金项目:国家自然科学基金资助项目(50704009);“十一五”国家科技支撑计划重点项目(2006BAE03B02-02).
作者单位
赵宁,王建辉,潘学民,马海涛,王来  
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中文摘要:
      研究了Cu含量对Sn- x Cu( x =0.7%,2%)、Sn-9Zn- x Cu( x =0,2%,10%)两种无铅钎料的基体组织以及与Cu基板短时间钎焊时界面金属间化合物(IMC)生长行为的影响.结果表明,当Sn-Cu钎料中Cu的含量为2%时,基体中IMC粗化为块状的Cu 6Sn 5相;对于Sn-9Zn- x Cu钎料合金,2%Cu元素的加入使得Sn-9Zn基体中长针状的富Zn相转化为Cu 5Zn 8相以及细小的富Zn相,而当Cu含量达到10%时,钎料基体中的IMC为CuZn相与Cu 6Sn 5相.在260 ℃短时间钎焊下,Cu含量的增加加速了Sn- x Cu/Cu界面IMC的粗化和生长;而对于Sn-9Zn- x Cu/Cu,Cu含量的增加却明显降低了界面IMC的生长速率.同时分析、讨论了界面IMC随钎焊时间变化的生长行为.
英文摘要:
      Two kinds of lead-free solders, Sn- x Cu( x =0.7%,2%) and Sn-9Zn- x Cu( x =0,2%,10%) were chosen. The microstructure as well as interfacial reactions between the selected lead-free solders and Cu substrate within short soldering time was studied. The intermetallic compounds (IMC) are coarsened into nubbly Cu 6Sn 5 phase by adding excessive Cu into Sn-Cu solder alloy. For Sn-9Zn- x Cu solder alloys, the long needle-like Zn rich phase which is the mainly existing form of Zn in Sn-Zn solders is transformed into Cu 5Zn 8 phase and fine Zn rich phase by the addition of 2% Cu, while CuZn phase and Cu 6Sn 5 phase are formed in Sn-9Zn-10Cu bulk alloy. When soldering within short time under 260 ℃, the ripening and growth of IMC at Sn- x Cu/Cu interface are accelerated with increasing Cu content in Sn-Cu solders. However, for Sn-9Zn- x Cu/Cu joints, the growth rate of IMC is decreased markedly with increasing Cu addition in Sn-Zn based solders, and Cu 6Sn 5 phase rather than Cu 5Zn 8 phase is formed at the interface when the Cu content is up to 10%. Meanwhile the growth behavior of IMC with the variation of soldering time is analyzed and discussed.
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