| 赵宁,王建辉,潘学民,马海涛,王来.Cu含量对Sn基无铅钎料组织、界面反应影响[J].,2008,(5):661-667 |
| Cu含量对Sn基无铅钎料组织、界面反应影响 |
| Effect of Cu content on microstructure and interfacial reactions of Sn-based lead-free solders |
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| DOI：10.7511/dllgxb200805008 |
| 中文关键词: 无铅钎料 Sn-Cu Sn-Zn-Cu 界面反应 生长行为 |
| 英文关键词: lead-free solder Sn-Cu Sn-Zn-Cu interfacial reaction growth behavior |
| 基金项目:国家自然科学基金资助项目(50704009)；“十一五”国家科技支撑计划重点项目(2006BAE03B02-02). |
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| 中文摘要: |
| 研究了Cu含量对Sn- x Cu( x =0.7%,2%)、Sn-9Zn- x Cu( x =0,2%,10%)两种无铅钎料的基体组织以及与Cu基板短时间钎焊时界面金属间化合物(IMC)生长行为的影响．结果表明，当Sn-Cu钎料中Cu的含量为2%时，基体中IMC粗化为块状的Cu 6Sn 5相；对于Sn-9Zn- x Cu钎料合金，2%Cu元素的加入使得Sn-9Zn基体中长针状的富Zn相转化为Cu 5Zn 8相以及细小的富Zn相，而当Cu含量达到10%时，钎料基体中的IMC为CuZn相与Cu 6Sn 5相．在260 ℃短时间钎焊下，Cu含量的增加加速了Sn- x Cu/Cu界面IMC的粗化和生长；而对于Sn-9Zn- x Cu/Cu，Cu含量的增加却明显降低了界面IMC的生长速率．同时分析、讨论了界面IMC随钎焊时间变化的生长行为． |
| 英文摘要: |
| Two kinds of lead-free solders, Sn- x Cu( x =0.7%,2%) and Sn-9Zn- x Cu( x =0,2%,10%) were chosen. The microstructure as well as interfacial reactions between the selected lead-free solders and Cu substrate within short soldering time was studied. The intermetallic compounds (IMC) are coarsened into nubbly Cu 6Sn 5 phase by adding excessive Cu into Sn-Cu solder alloy. For Sn-9Zn- x Cu solder alloys, the long needle-like Zn rich phase which is the mainly existing form of Zn in Sn-Zn solders is transformed into Cu 5Zn 8 phase and fine Zn rich phase by the addition of 2% Cu, while CuZn phase and Cu 6Sn 5 phase are formed in Sn-9Zn-10Cu bulk alloy. When soldering within short time under 260 ℃, the ripening and growth of IMC at Sn- x Cu/Cu interface are accelerated with increasing Cu content in Sn-Cu solders. However, for Sn-9Zn- x Cu/Cu joints, the growth rate of IMC is decreased markedly with increasing Cu addition in Sn-Zn based solders, and Cu 6Sn 5 phase rather than Cu 5Zn 8 phase is formed at the interface when the Cu content is up to 10%. Meanwhile the growth behavior of IMC with the variation of soldering time is analyzed and discussed. |
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