| 马雅丽,刘文开,路学成,刘冲.UV-LIGA工艺制作微注塑模具型腔[J].,2015,55(5):478-483 |
| UV-LIGA工艺制作微注塑模具型腔 |
| Machining micro-injection mold cavity by UV-LIGA process |
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| DOI：10.7511/dllgxb201505005 |
| 中文关键词: UV-LIGA技术 SU-8胶 微细电铸 微注塑模具型腔 |
| 英文关键词: UV-LIGA technology SU-8 photoresist micro-electroforming micro-injection mold cavity |
| 基金项目:“十一五”国家科技支撑计划资助项目(2006BAF04B13). |
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| 摘要点击次数: 1521 |
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| 中文摘要: |
| 设计并制作了微注塑模具型腔．利用无背板生长法，采用UV-LIGA套刻技术和掩膜腐蚀技术，直接在合金钢基底上制作具有微阵列结构、微注塑浇口、微排气通道、排气孔、聚合物熔体流道等结构的微注塑模具型腔．对SU-8厚胶的光刻工艺参数进行优化，给出厚度 350 μm 的SU-8胶的建议工艺条件 固定边框厚度进行刮胶；梯度升温前烘，自65 ℃至85 ℃每隔5 ℃间歇式升温，且85 ℃的烘焙时间为5.5~6.0 h；紫外光接触式曝光，剂量630 mJ/cm 2； 85 ℃ 中烘15 min，显影20 min．针对Ni微细电铸过程中产生节瘤现象分析原因并改善工艺参数，将电流密度和pH分别控制在3 A/dm 2以下和3.8~4.4．最终成功获得高质量的微注塑模具型腔． |
| 英文摘要: |
| A micro-injection mold cavity is designed and manufactured. By the method of no back plate growing technology, the micro-injection mold cavity with micro-array structure, micro-injection gate, micro-exhaust passage, exhaust vent and polymer melt flow channel is directly manufactured on an alloy steel substrate applying overlay UV-LIGA technology and mask etching technology. The optical lithography parameter of SU-8 thick photoresist is optimized and the proposed fabrication process for 350 μm SU-8 photoresist is given as follows: scraping photoresist by fixing the thickness of frame, prebaking by gradient heating-up and temperature rising every 5 ℃ from 65 ℃ to 85 ℃, at 85 ℃ for 5.5-6.0 h, UV contacting exposure with dose of 630 mJ/cm 2, post-baking at 85 ℃ for 15 min and development for 20 min. The causes for generating nodules in the process of Ni micro-electroforming are analyzed, and the process parameter is improved by controlling current density and pH respectively under 3 A/dm 2 and 3.8-4.4. As a result, the micro-injection mold cavity of good quality is gained successfully. |
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