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| 高压下碳纳米管阵列与金属的接触热阻研究 |
| Thermal contact resistance between CNT array and metal under high pressure |
| 投稿时间：2017-03-14 修订日期：2017-05-07 |
| DOI： |
| 中文关键词: 热界面材料 碳纳米管阵列 接触热阻 瞬态热反射测试 |
| 英文关键词: thermal interface material, CNT array, thermal contact resistance, transient thermo-reflectance measurement |
| 基金项目:国家自然科学基金（61131004）辽宁省自然科学基金（201602153） |
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| 中文摘要: |
| 碳纳米管具有很高的轴向热导率，基于碳纳米管阵列的热界面材料近年来得到了大量的关注。但碳纳米管与界面的接触热阻较大，限制了其进一步应用。相关的报道表明，碳纳米管阵列和金属的接触热阻在10 mm2K/W以上。目前通过化学成键等方法来改进，可以降至0.6mm2K/W。但这些方法需要牺牲纳米管耐高温的特点。本文研究了直接通过压力的方法改进纳米管与金属的接触热阻。对于高度为800微米的碳纳米管阵列，在压力为1.49Mpa的时候，测试得到的接触热阻为1.90~3.51 mm2K/W。这个结果接近化学成键方法的数据而远小于小压力下的值，为进一步减少碳纳米管接触热阻提供了新的思路。 |
| 英文摘要: |
| Due to its high axial thermal conductivity, carbon nanotube (CNT) arrays based thermal interface material has attracted much attention in recent years. The large thermal contact resistance between CNT array and contact surface is a bottleneck for its practical usage. A value of 10 mm2/K.W and larger has been reported for the thermal contact resistance. By chemical bonding through organic molecules, a value of as small as 0.6 mm2/K.W has been obtained. Since organics cannot endure high temperatures, such methods will limit CNT arrays to be used around room temperature. In this manuscript, thermal contact resistance of CNT array and Au surface is measured under a relative high pressure 1.46 MPa and gives a value between 1.90 and 3.51 mm2.K/W. Such a significant reduction of thermal contact resistance shed light on the thermal interface material usage of CNT array. |
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